For the component maker, the substitute for tin-lead in lead finishing should offer easy process control during electroplating, and an equivalent solderability performance and visual and mechanical quality. The challenge facing the electronics industry with regard to environmentally friendly packaging is to make a switch to materials and processes that have comparable reliability, manufacturability, price and availability. Comparison of tin-lead, pure tin and tin-copper surface appearance. The ultimate goal is to achieve environmentally friendly packaging while maintaining the equivalent or better moisture sensitivity level when reflow temperature is raised from 245 to 260☌.įigure 2. In addition, an assessment is done on the packages assembled with these new materials to verify the effects of the higher reflow peak temperature (260☌). This article aims to determine the suitability of pure tin and tin-copper as an alternative finish for component terminations, and the reliability performance of molding compounds without the bromine and antimony constituents. General reflow profile (260☌ peak temperature). In the electronics industry, the elimination of lead (Pb) used in surface finishing, and the brominated and antimony-containing materials used as flame retardants in molding compounds, has been the subject of research and discussion because of their detrimental effects on the human body and the environment.įigure 1. Increasing awareness of the environmental and health impact of various industrial materials has brought about changes to the way these are being used and processed. “The challenge facing the electronics industry with regard to environmentally friendly packaging is to make a switch to materials and processes that have comparable reliability, manufacturability, price and availability.” Investigating pure tin as an alternative finish
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |